Thin Wafer Thickness Measuring Device 'Real BG300'
Introducing a measuring device capable of measuring the thickness of a surface using a spiral trajectory on the Y-axis and θ-axis.
The "Real BG300" is a multifunctional thickness measurement device used after the backgrinding process. It features high-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis), allowing for the measurement of two center lines and the scribe line measurement between cut chips using the XYθ axes. Additionally, because it uses a transmissive displacement sensor, it can measure wafers with backgrinding frames and wafers with protective films. 【Features】 ■ Non-contact detection of silicon wafer thickness using a silicon transmissive displacement sensor ■ High-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis) ■ Capability to measure two center lines and scribe lines between cut chips ■ Ability to measure overall thickness using a spiral trajectory on the Y-axis and θ-axis ■ Can measure wafers with backgrinding frames and wafers with protective films *For more details, please refer to the PDF document or feel free to contact us.
- Company：土井精密ラップ
- Price：Other
