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Wafer Thickness Measuring Instrument - List of Manufacturers, Suppliers, Companies and Products

Wafer Thickness Measuring Instrument Product List

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Arnea Laboratory Co., Ltd. wafer thickness measurement device

Arnea Laboratory Co., Ltd. wafer thickness measurement device

The thickness of the silicon substrate is measured in real-time with high sensitivity and non-contact using a wavelength scanning method.

- Non-contact measurement of wafer thickness such as silicon and indium phosphide - Measurement possible in harsh environments, such as real-time measurement during wet etching - High sensitivity measurement with a precisely controlled wavelength-variable light source - High reproducibility with a measurement accuracy of less than 0.1μm - Customizable for measurement targets, sizes, and shapes other than silicon

  • Other measurement, recording and measuring instruments
  • Coating thickness gauge
  • Other optical parts

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Thin Wafer Thickness Measuring Device 'Real BG300'

Thin Wafer Thickness Measuring Device 'Real BG300'

Introducing a measuring device capable of measuring the thickness of a surface using a spiral trajectory on the Y-axis and θ-axis.

The "Real BG300" is a multifunctional thickness measurement device used after the backgrinding process. It features high-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis), allowing for the measurement of two center lines and the scribe line measurement between cut chips using the XYθ axes. Additionally, because it uses a transmissive displacement sensor, it can measure wafers with backgrinding frames and wafers with protective films. 【Features】 ■ Non-contact detection of silicon wafer thickness using a silicon transmissive displacement sensor ■ High-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis) ■ Capability to measure two center lines and scribe lines between cut chips ■ Ability to measure overall thickness using a spiral trajectory on the Y-axis and θ-axis ■ Can measure wafers with backgrinding frames and wafers with protective films *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments

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